the selection of appropriate reaction materials and deposition reactions helps to obtain high performance materials.

CVD, also called thin-film deposition, is used prevalently for electronics, optoelectronics, catalysis, and energy applications, such as semiconductors, silicon wafer preparation, and printable solar cells.CVD is used to fabricate structural materials and functional films in MEMS devices, such as polysilicon and silicon nitride.

Silicon nitride is synthesised typically by the chemical reaction of metallic silicon and gaseous nitrogen. Parts are carefully pressed and sintered by well-developed methods that give rise to particular properties and therefore define the end applications.Methods of formation vary depending on the type of silicon nitride required. Each adds specific strengths to the resultant material.

Applications of silicon nitrideThe unique electrical properties of silicon nitride have caused an increasing usage in microelectronics applications as an insulator and chemical barrier in the manufacture of integrated circuits for the protective packaging of devices. Silicon nitride is used as a passivation layer with a high diffusion barrier against water and sodium ions, both of which are major

Silicon Nitride (SiN) TEM window grids have a strong, flat, uniform silicon nitride membrane and are widely used as a stable viewing platform for TEM, SEM, Cryo-EM, AFM, Raman, XRD, and other equipment.Standard sizes range from 10 nm to 200 nm, but YW MEMS can respond quickly to customized design requirements and are very popular.

We know that the silicon nitride membrane window has the characteristics of low stress and can be applied to different experimental scenarios. So what are the main factors that determine the stress of the silicon nitride membrane window? We collate the relevant content for your reference: 1, deposition rate: deposition rate has a significant effect on the stress of silicon nitride membrane. Too fa